DocumentCode
3545638
Title
Power supply topologies for biphasic stimulation in inductively powered implants
Author
Wang, Guoxing ; Liu, Wentai ; Sivaprakasam, Mohanasankar ; Humayun, Mark S. ; Weiland, James D.
Author_Institution
Dept. of Electr. Eng., California Univ., Santa Cruz, CA, USA
fYear
2005
fDate
23-26 May 2005
Firstpage
2743
Abstract
Biphasic stimulation is commonly used for electrical stimulation of tissue in many implants. A dual voltage scheme is often used for the operation of the stimulus circuitry. Due to the advantages of wireless power transmission, an inductive link is used to recover the transmitted power and generate these voltages. This paper identifies the problem of additional power dissipation in the implant when the traditional rectifier topology with one diode is used. A dual diode topology is proposed which reduces the power dissipated in the implant by half. A detailed analysis for both topologies is done through derivation of expressions for the power losses on the primary and secondary coils. A comparison of single diode and dual diode topologies is presented under different conditions and inferences are drawn that can be used as design guidelines.
Keywords
coupled circuits; high-frequency transformers; network topology; neuromuscular stimulation; prosthetic power supplies; radio links; rectification; solid-state rectifiers; biphasic stimulation; dual diode rectifier topology; dual voltage stimulus circuitry; dual voltage supply; inductively powered implants; power supply topology; primary/secondary coil power losses; rectification; single diode rectifier topology; tissue electrical stimulation; wireless powered inductive link; Circuit topology; Diodes; Electrical stimulation; Implants; Power dissipation; Power generation; Power supplies; Power transmission; Rectifiers; Voltage; Biphasic stimulation; Dual diode; Dual voltage supply;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2005. ISCAS 2005. IEEE International Symposium on
Print_ISBN
0-7803-8834-8
Type
conf
DOI
10.1109/ISCAS.2005.1465194
Filename
1465194
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