• DocumentCode
    3545638
  • Title

    Power supply topologies for biphasic stimulation in inductively powered implants

  • Author

    Wang, Guoxing ; Liu, Wentai ; Sivaprakasam, Mohanasankar ; Humayun, Mark S. ; Weiland, James D.

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Santa Cruz, CA, USA
  • fYear
    2005
  • fDate
    23-26 May 2005
  • Firstpage
    2743
  • Abstract
    Biphasic stimulation is commonly used for electrical stimulation of tissue in many implants. A dual voltage scheme is often used for the operation of the stimulus circuitry. Due to the advantages of wireless power transmission, an inductive link is used to recover the transmitted power and generate these voltages. This paper identifies the problem of additional power dissipation in the implant when the traditional rectifier topology with one diode is used. A dual diode topology is proposed which reduces the power dissipated in the implant by half. A detailed analysis for both topologies is done through derivation of expressions for the power losses on the primary and secondary coils. A comparison of single diode and dual diode topologies is presented under different conditions and inferences are drawn that can be used as design guidelines.
  • Keywords
    coupled circuits; high-frequency transformers; network topology; neuromuscular stimulation; prosthetic power supplies; radio links; rectification; solid-state rectifiers; biphasic stimulation; dual diode rectifier topology; dual voltage stimulus circuitry; dual voltage supply; inductively powered implants; power supply topology; primary/secondary coil power losses; rectification; single diode rectifier topology; tissue electrical stimulation; wireless powered inductive link; Circuit topology; Diodes; Electrical stimulation; Implants; Power dissipation; Power generation; Power supplies; Power transmission; Rectifiers; Voltage; Biphasic stimulation; Dual diode; Dual voltage supply;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2005. ISCAS 2005. IEEE International Symposium on
  • Print_ISBN
    0-7803-8834-8
  • Type

    conf

  • DOI
    10.1109/ISCAS.2005.1465194
  • Filename
    1465194