DocumentCode :
3546130
Title :
A layout advisor for timing-critical bus routing
Author :
Huang, Wei ; Kahn, Andrew B.
Author_Institution :
Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
fYear :
1997
fDate :
7-10 Sep 1997
Firstpage :
210
Lastpage :
214
Abstract :
We describe a “topology advisor” for routing of critical (multisource) buses in building-block design. The tool accepts as input a block layout, a two-layer routing cost structure superposed over the block layout, terminal locations for a multi-source bus, and source-sink delay upper bound (linear or Elmore delay) constraints for all terminal pairs. The b best routing solutions (b a user parameter) that satisfy all constraints are returned. Efficient implementations of exhaustive search are used to guarantee optimal results when practical, and otherwise yield fast, high-quality results (if the problem is large or if the constraints are loose). Practical features include: (i) modeling of per-region and per-layer routing costs, (ii) routing to terminals located inside blocks, (iii) optional splitting of k-pin bus routes when the optimal routing passes through narrow channels, and (iv) heuristic speedups based on clustering and sampling
Keywords :
application specific integrated circuits; circuit layout CAD; delays; integrated circuit layout; network routing; network topology; timing; ASIC; clustering; exhaustive search; heuristic speedups; layout advisor; multisource buses; optional splitting; per-layer routing costs; per-region routing costs; routing solutions; sampling; source-sink delay upper bound; terminal locations; timing-critical bus routing; topology advisor; two-layer routing cost structure; Computer science; Cost function; Delay lines; Process design; Process planning; Repeaters; Routing; Sampling methods; Technology planning; Upper bound;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ASIC Conference and Exhibit, 1997. Proceedings., Tenth Annual IEEE International
Conference_Location :
Portland, OR
ISSN :
1063-0988
Print_ISBN :
0-7803-4283-6
Type :
conf
DOI :
10.1109/ASIC.1997.617007
Filename :
617007
Link To Document :
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