DocumentCode :
3546184
Title :
A 27 MHz temperature compensated MEMS oscillator with sub-ppm instability
Author :
Tabrizian, Roozbeh ; Pardo, Mauricio ; Ayazi, Farrokh
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2012
fDate :
Jan. 29 2012-Feb. 2 2012
Firstpage :
23
Lastpage :
26
Abstract :
This paper reports on the design, implementation and characterization of a low phase-noise 27 MHz MEMS oscillator with sub-ppm temperature instability based on a high-Q composite bulk acoustic wave (BAW) resonator. An array of silicon dioxide (SiO2) pillars has been uniformly embedded in the body of a piezoelectrically transduced silicon resonator to compensate its negative temperature coefficient of frequency (TCF). Using this technique, an overall frequency drift of 83 ppm is achieved for the resonator over the temperature range of -20°C to 100°C while resonator Q remains greater than 7,500 in atmospheric pressure. An electronically compensated oscillator using this resonator exhibits sub-ppm temperature instability with a consistent phase noise (PN) behavior over the entire temperature range and a value of -101 dBc/Hz at 1 kHz offset-frequency. Long-term stability measurement has been carried out for both temperature-compensated resonator and oscillator in an environmental chamber to study their stability over time.
Keywords :
bulk acoustic wave devices; crystal resonators; micromechanical resonators; microsensors; oscillators; silicon compounds; PN; SiO2; TCF; electronically compensated oscillator; environmental chamber; frequency 27 MHz; high-Q composite BAW resonator; high-Q composite bulk acoustic wave resonator; long-term stability measurement; negative temperature coefficient of frequency; phase noise; piezoelectrically transduced silicon resonator; silicon dioxide pillars array; temperature -20 degC to 100 degC; temperature compensated MEMS oscillator; temperature-compensated resonator; Micromechanical devices; Oscillators; Resonant frequency; Silicon; Temperature distribution; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location :
Paris
ISSN :
1084-6999
Print_ISBN :
978-1-4673-0324-8
Type :
conf
DOI :
10.1109/MEMSYS.2012.6170084
Filename :
6170084
Link To Document :
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