Failure modes and failure analysis of white LEDs

Author

Wu, Fugen ; Zhao, Wei ; Yang, Shaohua ; Zhang, Chunhua

Author_Institution

Exp. Center, Guangdong Univ. of Technol., Guangzhou, China

fYear

2009

fDate

16-19 Aug. 2009

Abstract

Reliability is one of primarily considered problems in white LED application. In this presentation, main failure modes in white LEDs such as ohmic contact degradation, electrode bonding defect, thermal mismatch and degradation of the encapsulation material, as well as ESD damage were analyzed, also combination with many failure analysis practices. Finally, several reliability assurance measures were discussed, which is helpful to improve reliability of LEDs in the solid state lighting applications.

Keywords

electrodes; electrostatic discharge; encapsulation; failure (mechanical); failure analysis; light emitting diodes; lighting; ohmic contacts; reliability; electrode bonding defect; electrostatic discharge damage; encapsulation material degradation; failure analysis; failure modes; ohmic contact degradation; reliability; solid state lighting applications; thermal mismatch; white LED; Bonding; Conducting materials; Electrodes; Electronic packaging thermal management; Encapsulation; Failure analysis; Light emitting diodes; Ohmic contacts; Thermal conductivity; Thermal degradation; Failure analysis; White LED; degradation; failure modes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Measurement & Instruments, 2009. ICEMI '09. 9th International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-3863-1

Electronic_ISBN

978-1-4244-3864-8

Type

conf

DOI

10.1109/ICEMI.2009.5274756

Filename

5274756