DocumentCode
3546412
Title
2DPCA-based Two-dimensional Maximum Interclass Distance Embedding for SAR ATR
Author
Jifang Pei ; Yulin Huang ; Xian Liu ; Jianyu Yang ; Zongjie Cao ; Bing Wang
Author_Institution
Sch. of Electron. Eng., Univ. of Electron. Sci. & Technol. of China (UESTC), Chengdu, China
Volume
1
fYear
2013
fDate
15-17 Nov. 2013
Firstpage
267
Lastpage
270
Abstract
Feature extraction from high-dimensional synthetic aperture radar (SAR) images is one of the crucial steps for SAR automatic target recognition (ATR). In this paper, we propose a new approach to SAR images feature extraction named Two-dimensional Principal Component Analysis-based Two-dimensional Maximum Interclass Distance Embedding (2DPCA-based 2DMIDE) which is based on manifold learning theory. The SAR image is projected into the feature space by horizontal 2DPCA and vertical 2DMIDE sequentially through this method. 2DPCA is efficient for image representation and preserves the global spatial structure of the original image, while 2DMIDE seeks to preserve the local spatial structure and the intrinsic geometry of the original image. Therefore, this feature extraction algorithm which fuses 2DPCA and 2DMIDE techniques can not only represent the original image in lower dimensions, but also excavate more powerful recognition information effectively. The experiment based on MSTAR database shows that the proposed method has a better recognition performance.
Keywords
feature extraction; image recognition; principal component analysis; radar imaging; radar target recognition; synthetic aperture radar; 2DMIDE; 2DPCA; SAR ATR; SAR images; automatic target recognition; high dimensional synthetic aperture radar; images feature extraction; local spatial structure; principal component analysis; two dimensional maximum interclass distance embedding; Algorithm design and analysis; Feature extraction; Image recognition; Manifolds; Principal component analysis; Synthetic aperture radar; Training;
fLanguage
English
Publisher
ieee
Conference_Titel
Communications, Circuits and Systems (ICCCAS), 2013 International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4799-3050-0
Type
conf
DOI
10.1109/ICCCAS.2013.6765230
Filename
6765230
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