Title :
Dry transfer bonding of porous silicon membranes to OSTE(+) polymer microfluidic devices
Author :
Saharil, Farizah ; Gylfason, Kristinn B. ; Liu, Yitong ; Haraldsson, Tommy ; Bettotti, Paolo ; Kumar, Neeraj ; Van Der Wijngaart, Wouter
Author_Institution :
Microsyst. Technol. Lab., KTH R. Inst. of Technol., Stockholm, Sweden
fDate :
Jan. 29 2012-Feb. 2 2012
Abstract :
We present low temperature transfer bonding of porous silicon membranes to polymeric microfluidic devices, using neither adhesives nor bond surface treatment. The transfer is enabled by a novel dual cure ternary monomer system containing thiolene and epoxy. The ability of the epoxy to react with almost any dry substrate provides a very versatile fabrication method. We characterize the two stage curing mechanism, describe the device fabrication, and evaluate the bond strength.
Keywords :
bonding processes; elemental semiconductors; microfabrication; microfluidics; polymers; porous semiconductors; silicon; OSTE(+) polymer microfluidic device; bond strength evaluation; device fabrication; dry substrate; dry transfer bonding; dual cure ternary monomer system; epoxy; fabrication method; low temperature transfer bonding; porous silicon membranes; thiolene; Biomembranes; Bonding; Microfluidics; Polymers; Silicon; Substrates; Surface treatment;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location :
Paris
Print_ISBN :
978-1-4673-0324-8
DOI :
10.1109/MEMSYS.2012.6170133
