DocumentCode :
3546524
Title :
Analyses of surface degradation of nanofilled polypropylene films through partial discharges & surface study
Author :
Poda, Anil Babu ; Basappa, Prathap
Author_Institution :
Dept. of Electron. Eng., Norfolk State Univ., Norfolk, VA, USA
fYear :
2013
fDate :
16-21 June 2013
Firstpage :
1
Lastpage :
1
Abstract :
The surface resistance of nanoparticles filled Poly Propylene (PP) to Partial Discharges(PD) is investigated in this work. PP films with different percentages of organoclay filled PP films were aged under 60 Hz AC voltages. Each sample was continuously aged for 8 hours with Rod-Plane profile electrodes in presence of surface discharges. Several characteristics such as Qavg, Qmax, Weibull distribution parameters of PD distributions were collected continuously with time using a Computerized PD Detection System. The change in the Breakdown strength due to aging by Partial Discharges was determined by using a ASTM D-149 breakdown strength measurement system using standardized electrodes for films. The results of experiments, statistical analyses as well as the model for the progression of aging in terms of observed PD (φ, q, n) measurements and surface defects caused on the samples due to PD for samples with different levels of nano-fillers has been analysed.
Keywords :
Weibull distribution; ageing; clay; electric breakdown; filled polymers; nanocomposites; nanofabrication; nanoparticles; particle reinforced composites; polymer films; surface resistance; ASTM D-149 breakdown strength measurement system; Weibull distribution parameters; aging; breakdown strength; computerized partial discharges detection system; frequency 60 Hz; nanofilled polypropylene films; nanofillers; nanoparticles; organoclay; partial discharges; statistical analyses; surface defects; surface degradation; surface resistance; time 8 h; Aging; Electrodes; Films; Handheld computers; Partial discharges; Surface discharges; Surface resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science (ICOPS), 2013 Abstracts IEEE International Conference on
Conference_Location :
San Francisco, CA
ISSN :
0730-9244
Type :
conf
DOI :
10.1109/PLASMA.2013.6633502
Filename :
6633502
Link To Document :
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