Analyses of surface degradation of nanofilled polypropylene films through partial discharges & surface study

Author

Poda, Anil Babu ; Basappa, Prathap

Author_Institution

Dept. of Electron. Eng., Norfolk State Univ., Norfolk, VA, USA

fYear

2013

fDate

16-21 June 2013

Firstpage

1

Lastpage

1

Abstract

The surface resistance of nanoparticles filled Poly Propylene (PP) to Partial Discharges(PD) is investigated in this work. PP films with different percentages of organoclay filled PP films were aged under 60 Hz AC voltages. Each sample was continuously aged for 8 hours with Rod-Plane profile electrodes in presence of surface discharges. Several characteristics such as Qavg, Qmax, Weibull distribution parameters of PD distributions were collected continuously with time using a Computerized PD Detection System. The change in the Breakdown strength due to aging by Partial Discharges was determined by using a ASTM D-149 breakdown strength measurement system using standardized electrodes for films. The results of experiments, statistical analyses as well as the model for the progression of aging in terms of observed PD (φ, q, n) measurements and surface defects caused on the samples due to PD for samples with different levels of nano-fillers has been analysed.

Keywords

Weibull distribution; ageing; clay; electric breakdown; filled polymers; nanocomposites; nanofabrication; nanoparticles; particle reinforced composites; polymer films; surface resistance; ASTM D-149 breakdown strength measurement system; Weibull distribution parameters; aging; breakdown strength; computerized partial discharges detection system; frequency 60 Hz; nanofilled polypropylene films; nanofillers; nanoparticles; organoclay; partial discharges; statistical analyses; surface defects; surface degradation; surface resistance; time 8 h; Aging; Electrodes; Films; Handheld computers; Partial discharges; Surface discharges; Surface resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Plasma Science (ICOPS), 2013 Abstracts IEEE International Conference on

Conference_Location

San Francisco, CA

ISSN

0730-9244

Type

conf

DOI

10.1109/PLASMA.2013.6633502

Filename

6633502