• DocumentCode
    3546546
  • Title

    Recent development on the modeling of electrical contact

  • Author

    Peng Zhang ; Lau, Y.Y.

  • Author_Institution
    Dept. of Nucl. Eng. & Radiol. Sci., Univ. of Michigan, Ann Arbor, MI, USA
  • fYear
    2013
  • fDate
    16-21 June 2013
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summary form only given. Electrical contact is an important issue to high power microwave sources, pulsed power systems, field emitters, thin film devices and integrated circuits, and interconnects, etc. Current crowding, which leads to intense local heating, is a well known phenomenon associated with contact resistance for the above areas. This paper summarizes recent development on the accurate evaluation of contact resistance for both horizontal [1-3] and vertical [3,4] contacts. By horizontal (vertical), we mean a current flow that is parallel (perpendicular) to the base of a contact member. The contact members may possess vastly different electrical resistivities, and arbitrary aspect ratios. The analytic calculations are validated by the MAXWELL codes. Current partitions in different regions are displayed. Current crowding is shown to occur within a distance of 0.44h of the rim of an electrode that is made in horizontal contact with a thin film of thickness h, regardless of the electrode shape [1,3]. A novel relation between AC bulk contact resistance and DC thin film contact resistance was discovered [3]. General scaling laws are presented.
  • Keywords
    contact resistance; electrical contacts; AC bulk contact resistance; DC thin film contact resistance; analytic calculations; contact member; current crowding; current partitions; electrical contact; electrical resistivities; field emitters; high power microwave sources; horizontal contacts; integrated circuits; intense local heating; interconnects; pulsed power systems; thin film devices; vertical contacts; Contact resistance; Educational institutions; Electrodes; Electron devices; Integrated circuit modeling; Proximity effects;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science (ICOPS), 2013 Abstracts IEEE International Conference on
  • Conference_Location
    San Francisco, CA
  • ISSN
    0730-9244
  • Type

    conf

  • DOI
    10.1109/PLASMA.2013.6633508
  • Filename
    6633508