DocumentCode :
3546591
Title :
Viscoplasticity of parylene-C film at body temperature
Author :
Lin, Jeffrey Chun-Hui ; Lam, Gilbert ; Tai, Yu-Chong
Author_Institution :
California Inst. of Technol., Pasadena, CA, USA
fYear :
2012
fDate :
Jan. 29 2012-Feb. 2 2012
Firstpage :
476
Lastpage :
479
Abstract :
As parylene-C, a thermal plastic, has been extensively used as an implant material, its viscoplastic behavior at body temperature has never been systematically studied. Presented here is the first extensive in vitro study of the viscoplastic behaviors of 20-μm-thick parylene-C film at 37°C. The viscoplastic behaviors are investigated by uniaxial tensile tests at different strain rates (Figure 2), cyclic loading/unloading test (Figure 3) abrupt strain rate changing (Figure 4), creep-recovery (Figure 5), and stress-relaxation (Figure 6). There are three major conclusions here. First, below a stress of 2.5MPa, no observable viscoplastic behavior of 20-μm-thick parylene-C is found. Secondly, parylene-C film is a strain (or stress) and strain-rate dependent viscoplastic material. Thirdly, Burger´s model is adequate to describe both creep and stress relaxation behaviors. In addition, the rate of the creep recovery (modeled with a single time constant) and stress relaxation (modeled with two time constants) decreases with increasing applied stress and/or strain.
Keywords :
polymer films; recovery-creep; stress relaxation; tensile strength; tensile testing; viscoplasticity; Burger model; creep-recovery; cyclic loading-unloading test; implant material; parylene-C film; size 20 mum; strain rate; stress relaxation; temperature 37 degC; thermal plastic; uniaxial tensile tests; viscoplasticity; Creep; Films; Fitting; Load modeling; Loading; Strain; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location :
Paris
ISSN :
1084-6999
Print_ISBN :
978-1-4673-0324-8
Type :
conf
DOI :
10.1109/MEMSYS.2012.6170170
Filename :
6170170
Link To Document :
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