DocumentCode
3546678
Title
Nano-patterned hydrogel reduced inflammatory effects in subcutaneous tissue
Author
Takahashi, M. ; Heo, Y.J. ; Shibata, H. ; Satou, H. ; Kawanishi, T. ; Okitsu, T. ; Takeuchi, S.
Author_Institution
Life BEANS Center, BEANS Project, Tokyo, Japan
fYear
2012
fDate
Jan. 29 2012-Feb. 2 2012
Firstpage
973
Lastpage
976
Abstract
We present a nano-patterned poly-acrylamide (PAAm) hydrogel that can reduce inflammatory effects after subcutaneous implantation. Although hydrogel is considered as an excellent biomaterial for implants due to its biocompatibility, hydrogel still induces inflammation after implantation. To enhance biocompatibility for subcutaneous implantable sensors, we modified hydrogel surface with nano-patterns using simple molding process. To test the anti-inflammatory effect, we implanted the samples to rat´s back. Since macrophages play an important role in the immune response and development of encapsulation after inflammation reaction, we counted macrophages neighboring the implanted nano-patterned hydrogels after 3 and 7 days and measured thickness of encapsulation after 21 days from implantation. We found that the sample with the line-and-space pattern of 600 nm in space successfully suppressed the inflammation reaction. Therefore, nano-patterned hydrogel is promising for long-term subcutaneous implantable sensors.
Keywords
biological tissues; biosensors; cellular biophysics; encapsulation; nanomedicine; nanopatterning; polymer gels; anti-inflammatory effect; biocompatibility; biomaterial; distance 600 nm; encapsulation; hydrogel surface; immune response; implant; implanted nanopatterned hydrogel; inflammation reaction; inflammatory effect; macrophage; molding process; nanopatterned hydrogel; nanopatterned poly-acrylamide hydrogel; subcutaneous implantable sensor; subcutaneous implantation; subcutaneous tissue; time 3 day to 21 day; Encapsulation; Fabrication; Implants; Silicon; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location
Paris
ISSN
1084-6999
Print_ISBN
978-1-4673-0324-8
Type
conf
DOI
10.1109/MEMSYS.2012.6170195
Filename
6170195
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