• DocumentCode
    3546678
  • Title

    Nano-patterned hydrogel reduced inflammatory effects in subcutaneous tissue

  • Author

    Takahashi, M. ; Heo, Y.J. ; Shibata, H. ; Satou, H. ; Kawanishi, T. ; Okitsu, T. ; Takeuchi, S.

  • Author_Institution
    Life BEANS Center, BEANS Project, Tokyo, Japan
  • fYear
    2012
  • fDate
    Jan. 29 2012-Feb. 2 2012
  • Firstpage
    973
  • Lastpage
    976
  • Abstract
    We present a nano-patterned poly-acrylamide (PAAm) hydrogel that can reduce inflammatory effects after subcutaneous implantation. Although hydrogel is considered as an excellent biomaterial for implants due to its biocompatibility, hydrogel still induces inflammation after implantation. To enhance biocompatibility for subcutaneous implantable sensors, we modified hydrogel surface with nano-patterns using simple molding process. To test the anti-inflammatory effect, we implanted the samples to rat´s back. Since macrophages play an important role in the immune response and development of encapsulation after inflammation reaction, we counted macrophages neighboring the implanted nano-patterned hydrogels after 3 and 7 days and measured thickness of encapsulation after 21 days from implantation. We found that the sample with the line-and-space pattern of 600 nm in space successfully suppressed the inflammation reaction. Therefore, nano-patterned hydrogel is promising for long-term subcutaneous implantable sensors.
  • Keywords
    biological tissues; biosensors; cellular biophysics; encapsulation; nanomedicine; nanopatterning; polymer gels; anti-inflammatory effect; biocompatibility; biomaterial; distance 600 nm; encapsulation; hydrogel surface; immune response; implant; implanted nanopatterned hydrogel; inflammation reaction; inflammatory effect; macrophage; molding process; nanopatterned hydrogel; nanopatterned poly-acrylamide hydrogel; subcutaneous implantable sensor; subcutaneous implantation; subcutaneous tissue; time 3 day to 21 day; Encapsulation; Fabrication; Implants; Silicon; Thickness measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
  • Conference_Location
    Paris
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-0324-8
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2012.6170195
  • Filename
    6170195