DocumentCode :
3546678
Title :
Nano-patterned hydrogel reduced inflammatory effects in subcutaneous tissue
Author :
Takahashi, M. ; Heo, Y.J. ; Shibata, H. ; Satou, H. ; Kawanishi, T. ; Okitsu, T. ; Takeuchi, S.
Author_Institution :
Life BEANS Center, BEANS Project, Tokyo, Japan
fYear :
2012
fDate :
Jan. 29 2012-Feb. 2 2012
Firstpage :
973
Lastpage :
976
Abstract :
We present a nano-patterned poly-acrylamide (PAAm) hydrogel that can reduce inflammatory effects after subcutaneous implantation. Although hydrogel is considered as an excellent biomaterial for implants due to its biocompatibility, hydrogel still induces inflammation after implantation. To enhance biocompatibility for subcutaneous implantable sensors, we modified hydrogel surface with nano-patterns using simple molding process. To test the anti-inflammatory effect, we implanted the samples to rat´s back. Since macrophages play an important role in the immune response and development of encapsulation after inflammation reaction, we counted macrophages neighboring the implanted nano-patterned hydrogels after 3 and 7 days and measured thickness of encapsulation after 21 days from implantation. We found that the sample with the line-and-space pattern of 600 nm in space successfully suppressed the inflammation reaction. Therefore, nano-patterned hydrogel is promising for long-term subcutaneous implantable sensors.
Keywords :
biological tissues; biosensors; cellular biophysics; encapsulation; nanomedicine; nanopatterning; polymer gels; anti-inflammatory effect; biocompatibility; biomaterial; distance 600 nm; encapsulation; hydrogel surface; immune response; implant; implanted nanopatterned hydrogel; inflammation reaction; inflammatory effect; macrophage; molding process; nanopatterned hydrogel; nanopatterned poly-acrylamide hydrogel; subcutaneous implantable sensor; subcutaneous implantation; subcutaneous tissue; time 3 day to 21 day; Encapsulation; Fabrication; Implants; Silicon; Thickness measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location :
Paris
ISSN :
1084-6999
Print_ISBN :
978-1-4673-0324-8
Type :
conf
DOI :
10.1109/MEMSYS.2012.6170195
Filename :
6170195
Link To Document :
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