DocumentCode
3546766
Title
Influences of specimen size and deformation mode on the strength of single-crystal silicon micro-beam structures
Author
Yamagiwa, H. ; Fujii, T. ; Namazu, T. ; Saito, M. ; Yamada, K. ; Miyatake, T.
Author_Institution
Univ. of Hyogo, Himeji, Japan
fYear
2012
fDate
Jan. 29 2012-Feb. 2 2012
Firstpage
444
Lastpage
447
Abstract
In this article, the influences of specimen size and deformation-mode on the fracture strength of single-crystal silicon (SCS) micro-beam structures are described. We have designed and developed a new materials test device that is able to apply pure torsion, torsion-bending-combined, and bending deformations to a micro-scale beam specimen. The differences in deformation-mode are determined by loading position and with or without plate support. The specimen made of SCS consists of a SCS plate supported by two SCS micro-beams, and a frame, and was fabricated by deep reactive ion etching (DRIE) with the same fabrication recipe. All the SCS specimens tested in those deformation-modes were fractured in a brittle manner at a laboratory temperature. The fractured strength was calculated assuming that all the specimens had an ideal flat surface, and the data were arranged using two-parameter Weibull distribution function. Both the specimen size and deformation-mode dependencies were apparently found. To estimate the “true” strength, finite element analyses (FEAs) using the models that included scalloping sidewalls were carried out. The revised strength data that were estimated by multiplying stress concentration factors into the original data suggested that no deformation-mode dependency on strength existed. Based on scanning electron microscopy (SEM) analyses, we have found that specimen size dependency was probably related to the number of nanoscale surface defects that were introduced during a DRIE process.
Keywords
finite element analysis; microfabrication; scanning electron microscopy; silicon; sputter etching; deep reactive ion etching; deformation mode dependency; finite element analyses; fracture strength; microbeam structures; scanning electron microscopy; single crystal silicon; specimen size; torsion bending; Force; Laser beams; Materials; Shape; Strain; Stress; Surface morphology;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location
Paris
ISSN
1084-6999
Print_ISBN
978-1-4673-0324-8
Type
conf
DOI
10.1109/MEMSYS.2012.6170221
Filename
6170221
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