Title :
A 600°C wireless multimorph-based capacitive MEMS temperature sensor for component health monitoring
Author :
Scott, S. ; Scuderi, M. ; Peroulis, D.
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
fDate :
Jan. 29 2012-Feb. 2 2012
Abstract :
This paper presents the design and fabrication of a new packaged MEMS capacitive temperature sensor for engine component health-monitoring applications and measurement results above 500-600°C. The multimorphs employed are thermal-SiO2/LPCVD-Si3N4/sputtered-Au beams designed for deflection at these temperatures. The mean initial capacitance of the sensors is 6.441 pF; with a standard deviation of 0.197 pF. The robust fabrication process and packaging yield consistent capacitance-temperature profiles from device-to-device. Similarly, the devices exhibit a consistently-high measured average quality factor of 1,727 with a standard deviation of 54 for 5 packaged devices. Also presented are laser confocal microscope profiles from the thermal-annealing process, detailing the break-in period, after which no additional creep is observed, even after over 24 hours at 650°C. This is a first-of-its-kind MEMS sensor with unparalleled performance for harsh-environment wireless temperature sensing.
Keywords :
annealing; capacitive sensors; chemical vapour deposition; gold; microsensors; silicon compounds; sputtered coatings; temperature sensors; Au; LPCVD; Si3N4; SiO2; break-in period; capacitive MEMS temperature sensor; component health monitoring; laser confocal microscope profiles; packaging yield; quality factor; sputtered-Au beams; temperature 500 degC to 600 degC; temperature 650 degC; thermal annealing; time 24 hour; wireless multimorph; Capacitance; Fabrication; Q factor; Temperature; Temperature measurement; Temperature sensors;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location :
Paris
Print_ISBN :
978-1-4673-0324-8
DOI :
10.1109/MEMSYS.2012.6170246