Title : 
Implementation of vertical-integrated dual mode inductive-capacitive proximity sensor
         
        
            Author : 
Lo, Pei-Hsuan ; Hong, Chitsung ; Tseng, Shih-Hsiung ; Yeh, Jen-Hao ; Fang, Weileun
         
        
            Author_Institution : 
Inst. of NanoEngineering & Microsyst., Nat. Tsing Hua Univ., Hsinchu, Taiwan
         
        
        
            fDate : 
Jan. 29 2012-Feb. 2 2012
         
        
        
        
            Abstract : 
This study extends the authors´ previous concept to employ nanoporous anodic aluminum oxide (np-AAO) as insulation and dielectric layer [1] to form the vertical-integrated inductive-capacitive proximity sensor. The advantages of this vertical-integrated inductive-capacitive proximity sensor are as follows, (1) enlarge the range of sensing distance: capacitive-sensing remains sensitive for short-distance object and long-distance object remains detectable by inductive-sensing, (2) conductive and non-conductive objects can be detected, (3) chip size is reduced by the vertical-integrated design, (4) fringe-effect is enhanced by the spiral-coil, and (5) np-AAO has good electrical properties: dielectric constant 7.4 (oxide:3.9), electrical resistivity: over hundred MΩ,-cm (similar to oxide). Preliminary fabrication results demonstrate the vertically integrated inductive-capacitive proximity sensor, and the tests show its sensing-range can reach 0.5~5mm.
         
        
            Keywords : 
capacitive sensors; inductive sensors; insulation; microfabrication; microsensors; nanoporous materials; object detection; conductive object detection; dielectric constant; dielectric layer; electrical property; electrical resistivity; fringe-effect enhancement; long-distance object sensitivity; nanoporous anodic aluminum oxide insulation; nonconductive object detection; np-AAO insulation; short-distance object sensitivity; spiral-coil; vertical-integrated dual mode inductive-capacitive proximity sensor; Capacitance; Fingers; Metals; Robot sensing systems; Silicon;
         
        
        
        
            Conference_Titel : 
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
         
        
            Conference_Location : 
Paris
         
        
        
            Print_ISBN : 
978-1-4673-0324-8
         
        
        
            DOI : 
10.1109/MEMSYS.2012.6170268