• DocumentCode
    3546948
  • Title

    Implementation of vertical-integrated dual mode inductive-capacitive proximity sensor

  • Author

    Lo, Pei-Hsuan ; Hong, Chitsung ; Tseng, Shih-Hsiung ; Yeh, Jen-Hao ; Fang, Weileun

  • Author_Institution
    Inst. of NanoEngineering & Microsyst., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2012
  • fDate
    Jan. 29 2012-Feb. 2 2012
  • Firstpage
    640
  • Lastpage
    643
  • Abstract
    This study extends the authors´ previous concept to employ nanoporous anodic aluminum oxide (np-AAO) as insulation and dielectric layer [1] to form the vertical-integrated inductive-capacitive proximity sensor. The advantages of this vertical-integrated inductive-capacitive proximity sensor are as follows, (1) enlarge the range of sensing distance: capacitive-sensing remains sensitive for short-distance object and long-distance object remains detectable by inductive-sensing, (2) conductive and non-conductive objects can be detected, (3) chip size is reduced by the vertical-integrated design, (4) fringe-effect is enhanced by the spiral-coil, and (5) np-AAO has good electrical properties: dielectric constant 7.4 (oxide:3.9), electrical resistivity: over hundred MΩ,-cm (similar to oxide). Preliminary fabrication results demonstrate the vertically integrated inductive-capacitive proximity sensor, and the tests show its sensing-range can reach 0.5~5mm.
  • Keywords
    capacitive sensors; inductive sensors; insulation; microfabrication; microsensors; nanoporous materials; object detection; conductive object detection; dielectric constant; dielectric layer; electrical property; electrical resistivity; fringe-effect enhancement; long-distance object sensitivity; nanoporous anodic aluminum oxide insulation; nonconductive object detection; np-AAO insulation; short-distance object sensitivity; spiral-coil; vertical-integrated dual mode inductive-capacitive proximity sensor; Capacitance; Fingers; Metals; Robot sensing systems; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
  • Conference_Location
    Paris
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-0324-8
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2012.6170268
  • Filename
    6170268