SMT mixed soldering process designing parameters integrated analyzing platform

Mixed soldering is widely used in military, aerospace and medical electronics production, lead solder paste is used combined with lead-free components. It is necessary to choose proper soldering process design parameters to ensure the mixed solder joint´s high reliability. In this paper, the SMT mixed soldering process designing parameters integrated analyzing platform is developed, which can help the users to design the proper process parameters. Visual C++ secondary development technology is used to build the platform which contains series of steps in designing the mixed soldering parameters. Firstly, the solder joint´s three-dimensional shape model is established combined with the solder joint´s process designing parameters, the shape model is converted to the finite element model by the platform; Secondly, run the import file to analyzing the solder joint´s reliability by finite element method; Finally, neural networks and genetic algorithm is used for optimizing the reliability to get the best solder joint´s process designing parameters.