DocumentCode
3547510
Title
Femtosecond laser machining
Author
Banks, P.S. ; Stuart, B.C. ; Perry, M.D. ; Feit, M.D. ; Rubenchik, A.M. ; Armstrong, J.P. ; Nguyen, H. ; Roeske, F. ; Lee, R.S. ; Myers, B.R. ; Sefcik, J.A.
Author_Institution
Lawrence Livermore Nat. Lab., CA, USA
fYear
1998
fDate
3-8 May 1998
Firstpage
510
Abstract
Summary form only given. The use of femtosecond lasers allows materials processing of practically any material with extremely high precision and minimal collateral damage. Advantages over conventional laser machining (using pulses longer than a few tens of picoseconds) are realized by depositing the laser energy into the electrons of the material on a time scale short compared to the transfer time of this energy to the bulk of the material, resulting in increased ablation efficiency and negligible shock or thermal stress. Using a 4-W Ti:sapphire CPA laser, we produced cuts and holes in several explosives for a variety of laser parameters with no observable impact on the remaining material.
Keywords
chirp modulation; cutting; explosions; high-speed optical techniques; laser ablation; laser beam machining; optical modulation; sapphire; solid lasers; titanium; 150 fs; 4 W; Ti:sapphire CPA laser; cuts; explosives; extremely high precision; femtosecond laser machining; femtosecond laser materials processing; holes; increased ablation efficiency; laser ablation; laser energy; laser parameters; minimal collateral damage; time scale; transfer time; Electric shock; Electrons; Laser ablation; Laser beam cutting; Machining; Materials processing; Optical materials; Optical pulses; Pulsed laser deposition; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on
Conference_Location
San Francisco, CA, USA
Print_ISBN
1-55752-339-0
Type
conf
DOI
10.1109/CLEO.1998.676560
Filename
676560
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