DocumentCode
3547546
Title
Submicron lines in thin metal films micromachined by an ultrafast laser oscillator
Author
Liu, Xindong
Author_Institution
Center for Ultrafast Opt. Sci., Michigan Univ., Ann Arbor, MI, USA
fYear
1998
fDate
3-8 May 1998
Firstpage
511
Abstract
Summary form only given. We demonstrate submicron micromachining with an ultrafast laser oscillator for the first time. The laser used was a 100-fs Ti:sapphire laser with an output power of 0.35 W operating at 89 MHz. A Faraday isolator was used to reject any backreflection from the work piece. A wave plate and polarizer combination was used to vary the laser power incident on target.
Keywords
high-speed optical techniques; laser beam machining; micromachining; optical isolators; optical polarisers; 0.35 W; 100 fs; Faraday isolator; backreflection; fs Ti:sapphire laser; laser beam micromachining; laser power; output power; polarizer; submicron lines; submicron micromachining; thin metal films; ultrafast laser oscillator; wave plate; work piece; Ionization; Laser ablation; Laser theory; Machining; Optical films; Optical pulses; Optical scattering; Oscillators; Surface emitting lasers; Ultrafast optics;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on
Conference_Location
San Francisco, CA, USA
Print_ISBN
1-55752-339-0
Type
conf
DOI
10.1109/CLEO.1998.676563
Filename
676563
Link To Document