Title :
Advanced laser microjoining for MEMS applications
Author_Institution :
Fraunhofer-Inst. fur Lasertech., Aachen, Germany
Abstract :
Summary form only given. With new developments, laser joining can be used also for packaging and assembly of fluidic systems made from silicon, glass, and polymers in conjunction with metals. Different laser-joining technologies are listed that are suitable for MEMS microsystem packaging. As can be seen from the table, laser joining is especially suitable for applications at high temperatures and harsh atmospheres and surroundings, such as sensors and other electric components for the use in automotive parts.
Keywords :
automotive electronics; joining processes; laser materials processing; micro-optics; micromechanical devices; packaging; MEMS applications; MEMS microsystem packaging; advanced laser microjoining; automotive parts; electric components; fluidic system assembly; harsh atmospheres; high temperatures; laser joining; laser-joining technologies; packaging; sensors; Atmosphere; Chemical lasers; Gas lasers; Laser excitation; Micromechanical devices; Optical pulses; Packaging; Silicon; Surface emitting lasers; Surface treatment;
Conference_Titel :
Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
1-55752-339-0
DOI :
10.1109/CLEO.1998.676565
