Advanced laser microjoining for MEMS applications

Author

Gillner, A.

Author_Institution

Fraunhofer-Inst. fur Lasertech., Aachen, Germany

fYear

1998

fDate

3-8 May 1998

Firstpage

512

Lastpage

513

Abstract

Summary form only given. With new developments, laser joining can be used also for packaging and assembly of fluidic systems made from silicon, glass, and polymers in conjunction with metals. Different laser-joining technologies are listed that are suitable for MEMS microsystem packaging. As can be seen from the table, laser joining is especially suitable for applications at high temperatures and harsh atmospheres and surroundings, such as sensors and other electric components for the use in automotive parts.

Keywords

automotive electronics; joining processes; laser materials processing; micro-optics; micromechanical devices; packaging; MEMS applications; MEMS microsystem packaging; advanced laser microjoining; automotive parts; electric components; fluidic system assembly; harsh atmospheres; high temperatures; laser joining; laser-joining technologies; packaging; sensors; Atmosphere; Chemical lasers; Gas lasers; Laser excitation; Micromechanical devices; Optical pulses; Packaging; Silicon; Surface emitting lasers; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on

Conference_Location

San Francisco, CA, USA

Print_ISBN

1-55752-339-0

Type

conf

DOI

10.1109/CLEO.1998.676565

Filename

676565