Noise generation, coupling, isolation, and EM radiation in high-speed package and PCB

The return current path is the most critical part of high-speed interconnection design in both package and PCB. When the return current path is disturbed, significant amount of noise generation, coupling, and radiated emission problems occur. Signal vias and power/ground vias produce a return current path disconnect problem. In this paper, we demonstrate that the via is a major source of the SSN (simultaneous switching noise) generation, coupling, and edge radiated emission in multi-layer packages and PCBs.