• DocumentCode
    3547760
  • Title

    Accurate and closed-form SPICE compatible passive macromodels for distributed interconnects with frequency dependent parameters

  • Author

    Nakhla, Natalie ; Achar, Ram ; Nakhla, Michel

  • Author_Institution
    Dept. of Electron., Carleton Univ., Ont., Canada
  • fYear
    2005
  • fDate
    23-26 May 2005
  • Firstpage
    5770
  • Abstract
    Fast and accurate signal integrity analysis is becoming a major requirement in validation of high-speed designs. This demands efficient and accurate models for high-speed distributed interconnects. Also, it has been demonstrated that preserving the passivity of the macromodel is essential to guarantee a stable global transient simulation. An efficient method for the analysis of high-speed distributed interconnects with frequency-dependent parameters is presented The proposed method enables representation of the distributed stamp in terms of simple delay and resistive elements. The new method, while guaranteeing the passivity of the macromodel, provides significant speedup, and enables easy implementation. Necessary formulation and validation examples are given.
  • Keywords
    SPICE; circuit simulation; delays; integrated circuit interconnections; integrated circuit modelling; VLSI; closed-form SPICE compatible passive macromodels; delay elements; frequency dependent parameters; frequency-dependent parameters; high-speed designs; high-speed distributed interconnects; resistive elements; signal integrity analysis; Circuit simulation; Delay; Distributed parameter circuits; Frequency dependence; Integrated circuit interconnections; Power system transients; SPICE; Signal analysis; Transmission line matrix methods; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2005. ISCAS 2005. IEEE International Symposium on
  • Print_ISBN
    0-7803-8834-8
  • Type

    conf

  • DOI
    10.1109/ISCAS.2005.1465949
  • Filename
    1465949