DocumentCode
3547760
Title
Accurate and closed-form SPICE compatible passive macromodels for distributed interconnects with frequency dependent parameters
Author
Nakhla, Natalie ; Achar, Ram ; Nakhla, Michel
Author_Institution
Dept. of Electron., Carleton Univ., Ont., Canada
fYear
2005
fDate
23-26 May 2005
Firstpage
5770
Abstract
Fast and accurate signal integrity analysis is becoming a major requirement in validation of high-speed designs. This demands efficient and accurate models for high-speed distributed interconnects. Also, it has been demonstrated that preserving the passivity of the macromodel is essential to guarantee a stable global transient simulation. An efficient method for the analysis of high-speed distributed interconnects with frequency-dependent parameters is presented The proposed method enables representation of the distributed stamp in terms of simple delay and resistive elements. The new method, while guaranteeing the passivity of the macromodel, provides significant speedup, and enables easy implementation. Necessary formulation and validation examples are given.
Keywords
SPICE; circuit simulation; delays; integrated circuit interconnections; integrated circuit modelling; VLSI; closed-form SPICE compatible passive macromodels; delay elements; frequency dependent parameters; frequency-dependent parameters; high-speed designs; high-speed distributed interconnects; resistive elements; signal integrity analysis; Circuit simulation; Delay; Distributed parameter circuits; Frequency dependence; Integrated circuit interconnections; Power system transients; SPICE; Signal analysis; Transmission line matrix methods; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2005. ISCAS 2005. IEEE International Symposium on
Print_ISBN
0-7803-8834-8
Type
conf
DOI
10.1109/ISCAS.2005.1465949
Filename
1465949
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