• DocumentCode
    3547895
  • Title

    An 800 Mbps system interconnect modeling and simulation for high speed computing

  • Author

    Sharawi, Mohammad S. ; Aloi, Daniel N.

  • Author_Institution
    Dept. of Electr. & Syst. Eng., Oakland Univ., Rochester, MI, USA
  • fYear
    2005
  • fDate
    23-26 May 2005
  • Firstpage
    6198
  • Abstract
    System interconnect modeling for high speed systems is a vital bottleneck for high speed data transfer. We demonstrate the modeling process on a high speed computer differential net running at 400 MHz (800 Mbit/s) with IBM I/O cells. The modeling of the traces on the boards was done using a field solver. The transmission line matrices were used in a SPICE model, and 3-simulation scenarios were tested for this model. The obtained EYE opening of the modeled interconnect simulation was 705 mV while the measured EYE opening for the same net topology in the laboratory was 710 mV. This shows a close match between the actual behavior and the model generated. Careful modeling can be very beneficial to get a design running at first time operation.
  • Keywords
    SPICE; integrated circuit interconnections; printed circuit design; printed circuits; transmission line matrix methods; 400 MHz; 800 Mbit/s; EYE opening; IBM I/O cells; SPICE model; high speed computer differential net; high speed computing; simulation; system interconnect modeling; transmission line matrices; Computational modeling; Connectors; Driver circuits; Electromagnetic modeling; Etching; Frequency; Integrated circuit interconnections; Personal digital assistants; Power cables; Wire; High Speed; Interconnect; PCB; Signal In-tegrity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2005. ISCAS 2005. IEEE International Symposium on
  • Print_ISBN
    0-7803-8834-8
  • Type

    conf

  • DOI
    10.1109/ISCAS.2005.1466056
  • Filename
    1466056