Title :
Silicon compilation: the answer to reducing IC development costs [Keynote Address II]
Abstract :
Provides an abstract of the keynote presentation and a brief professional biography of the presenter. The complete presentation was not made available for publication as part of the conference proceedings.
Keywords :
Automatic control; Chip scale packaging; Costs; Data models; Design automation; Design methodology; Digital integrated circuits; Engines; Silicon; System-on-a-chip;
Conference_Titel :
Design Automation Conference, 2005. Proceedings of the ASP-DAC 2005. Asia and South Pacific
Conference_Location :
Shanghai
Print_ISBN :
0-7803-8736-8
DOI :
10.1109/ASPDAC.2005.1466388
