Title :
Moire stabilized thermal imaging
Author_Institution :
FA Instruments, Inc., San Jose, CA, USA
fDate :
27 June-1 July 2005
Abstract :
A new method of backside thermal mapping based on the relationship between mechanical strain and local interference pattern shifts will be shown for the first time. Sensitivity will be shown to be far superior to IR camera imaging methods and comparable to fluorescence microthermal imaging (FMI), allowing entire array blocks with low power consumption to be identified. This new method of acquisition controls synchronously the thermal propagation, while building up the thermal signal to enhance the Moire pattern sensitivity.
Keywords :
fault diagnosis; flaw detection; infrared imaging; integrated circuit testing; light interferometry; moire fringes; IR camera imaging methods; Moire pattern sensitivity; backside thermal mapping; fluorescence microthermal imaging; local interference pattern shifts; low power consumption; mechanical strain; thermal imaging; thermal propagation; thermal signal; Cameras; Capacitive sensors; Charge coupled devices; Energy consumption; Infrared imaging; Instruments; Interference; Nonhomogeneous media; Optical imaging; Silicon;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN :
0-7803-9301-5
DOI :
10.1109/IPFA.2005.1469153
