Built-in via module test structure for backend interconnection in-line process monitor

Author

Li, H.Y. ; Li, W.H. ; Wong, L.Y. ; Hwang, N.

Author_Institution

Inst. of Microelectron., Singapore

fYear

2005

fDate

27 June-1 July 2005

Firstpage

167

Lastpage

170

Abstract

The best in-line process monitoring test structure should have multiple purposes, one of which is to allow easy assessing and quick defect identification. In this study, the via module test structure has been designed allowing easy assessment of the via profiles of via, coupled with the resistance measurement of the via, such can be used as effect via module defect monitor. This structure can be used as frame monitor structure. Via module test structure is realized in Cu/low K (Black Diamond ™) interconnection.

Keywords

built-in self test; fault diagnosis; integrated circuit interconnections; process monitoring; Cu; built-in via module test structure; defect identification; frame monitor structure; in-line process monitoring test structure; low k interconnection; module defect monitoring; resistance measurement; via profiles; Brightness; Detectors; Electric resistance; Electric variables measurement; Electrical resistance measurement; Joining processes; Microelectronics; Monitoring; Process control; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the

Print_ISBN

0-7803-9301-5

Type

conf

DOI

10.1109/IPFA.2005.1469154

Filename

1469154