Title :
Dynamic SIMS study on failure analysis of multiple E-test failure in wafer fabrication
Author :
Gui, D ; Hua, Y.N. ; Eng, C.S. ; Ooi, S.C. ; Goh, A.
Author_Institution :
Chartered Semicond. Mfg. Ltd., Singapore
fDate :
27 June-1 July 2005
Abstract :
A case of multiple failures at the end of line (EOL) electrical test (E-test) was encountered in wafer fabrication. In this paper, we will present a significant study of multiple E-test failure case, using CAMECA IMS Wf instrument. The results show that the failure is relate to the quality of incoming starting materials.
Keywords :
failure analysis; fault diagnosis; integrated circuit reliability; integrated circuit technology; integrated circuit testing; scanning electron microscopy; secondary ion mass spectroscopy; CAMECA IMS Wf instrument; EOL electrical test; failure analysis; multiple E-test failure; wafer fabrication; Chemical analysis; Condition monitoring; Fabrication; Failure analysis; MOS devices; Mass spectroscopy; Quality control; Silicon; Testing; Wood industry;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN :
0-7803-9301-5
DOI :
10.1109/IPFA.2005.1469162
