DocumentCode
3549741
Title
Automatic target preparation of electronic and microelectronic components with the new TargetSystem
Author
Reiter, K.H. ; Lähn, J. ; Bundgaard, Hans
Author_Institution
Fraunhofer Inst. of Silicon Technol., Itzehoe, Germany
fYear
2005
fDate
27 June-1 July 2005
Firstpage
226
Lastpage
229
Abstract
The TargetSystem has been described and preparation methods for achieving good sample surfaces were developed. The TargetSystem is suitable for metallographic failure analysis of electronic and microelectronic components. The desired preparation planes of several similar samples were reached precisely and the process was reproducible. To manually prepare these samples with good quality surfaces is difficult and time consuming and can only be done by experienced metallographers. In manual preparation there is always a risk of grinding past the target after which the specimen is irrevocably lost. After an introduction and a brief training period, it is possible to prepare difficult samples with the TargetSystem within short time, with high precision and good reproducibility.
Keywords
failure analysis; manufacturing systems; materials preparation; metallography; TargetSystem; automatic target preparation; electronic components; microelectronic components; preparation methods; Electronic components; Electronics packaging; Failure analysis; Gold; Microelectronics; Nonhomogeneous media; Research and development; Silicon; Suspensions; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN
0-7803-9301-5
Type
conf
DOI
10.1109/IPFA.2005.1469167
Filename
1469167
Link To Document