Title :
Automatic target preparation of electronic and microelectronic components with the new TargetSystem
Author :
Reiter, K.H. ; Lähn, J. ; Bundgaard, Hans
Author_Institution :
Fraunhofer Inst. of Silicon Technol., Itzehoe, Germany
fDate :
27 June-1 July 2005
Abstract :
The TargetSystem has been described and preparation methods for achieving good sample surfaces were developed. The TargetSystem is suitable for metallographic failure analysis of electronic and microelectronic components. The desired preparation planes of several similar samples were reached precisely and the process was reproducible. To manually prepare these samples with good quality surfaces is difficult and time consuming and can only be done by experienced metallographers. In manual preparation there is always a risk of grinding past the target after which the specimen is irrevocably lost. After an introduction and a brief training period, it is possible to prepare difficult samples with the TargetSystem within short time, with high precision and good reproducibility.
Keywords :
failure analysis; manufacturing systems; materials preparation; metallography; TargetSystem; automatic target preparation; electronic components; microelectronic components; preparation methods; Electronic components; Electronics packaging; Failure analysis; Gold; Microelectronics; Nonhomogeneous media; Research and development; Silicon; Suspensions; Wires;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN :
0-7803-9301-5
DOI :
10.1109/IPFA.2005.1469167