• DocumentCode
    3549741
  • Title

    Automatic target preparation of electronic and microelectronic components with the new TargetSystem

  • Author

    Reiter, K.H. ; Lähn, J. ; Bundgaard, Hans

  • Author_Institution
    Fraunhofer Inst. of Silicon Technol., Itzehoe, Germany
  • fYear
    2005
  • fDate
    27 June-1 July 2005
  • Firstpage
    226
  • Lastpage
    229
  • Abstract
    The TargetSystem has been described and preparation methods for achieving good sample surfaces were developed. The TargetSystem is suitable for metallographic failure analysis of electronic and microelectronic components. The desired preparation planes of several similar samples were reached precisely and the process was reproducible. To manually prepare these samples with good quality surfaces is difficult and time consuming and can only be done by experienced metallographers. In manual preparation there is always a risk of grinding past the target after which the specimen is irrevocably lost. After an introduction and a brief training period, it is possible to prepare difficult samples with the TargetSystem within short time, with high precision and good reproducibility.
  • Keywords
    failure analysis; manufacturing systems; materials preparation; metallography; TargetSystem; automatic target preparation; electronic components; microelectronic components; preparation methods; Electronic components; Electronics packaging; Failure analysis; Gold; Microelectronics; Nonhomogeneous media; Research and development; Silicon; Suspensions; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
  • Print_ISBN
    0-7803-9301-5
  • Type

    conf

  • DOI
    10.1109/IPFA.2005.1469167
  • Filename
    1469167