Title :
Unencapsulated cross-section method for microelectronic packaged devices
Author :
Liechty, G.D. ; Hirsch, E.A.
Author_Institution :
Allied High Tech Products Inc., Rancho Dominguez, CA, USA
fDate :
27 June-1 July 2005
Abstract :
This paper will illustrate a procedure using the MultiPrep™ System an optical microscope and imaging system can be used to consistently and accurately prepare cross-sections of packaged devices while reducing consumables usage and saving preparation time to increase sample throughput and improve surface finishes.
Keywords :
cameras; integrated circuit packaging; optical images; optical microscopes; optical microscopy; MultiPrep System; cross-sections preparation; imaging system; microelectronic packaged devices; optical microscope; surface finishes; unencapsulated cross-section method; Electronics packaging; Fixtures; Image color analysis; Microelectronics; Optical devices; Optical imaging; Optical microscopy; Packaging machines; Polishing machines; Scanning electron microscopy;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN :
0-7803-9301-5
DOI :
10.1109/IPFA.2005.1469169
