DocumentCode :
3549756
Title :
Circuitry analyses by using high quality image acquisition and multi-layer image merge technique
Author :
Yao, H.P. ; Zhong, Qi ; Ku, Vic ; Lo, C.K. ; Wu, Y.R. ; Hsieh, Y.F.
Author_Institution :
Sanguine Semicond. Consulting Inc., Shanghai, China
fYear :
2005
fDate :
27 June-1 July 2005
Firstpage :
294
Lastpage :
297
Abstract :
By using high quality image acquisition and multi-layer image merge technique, a technique of IC circuitry analysis has been developed and successfully applied to more than 50 industrial products analysis in one year. A series of in-house designed software ensures the successful rate to be up to 95% and the total working time to be less than 2 months for analog/mix-signal ICs of any scale and typically 10 ∼100K gates counts digital devices. The software environment was also featured by multiple language, multiple users accessible, project teamwork feasible, TCL script extension support, automatic backup/restore, and GUI based in Windows, Linux, and UNIX platform.
Keywords :
circuit analysis computing; graphical user interfaces; image processing; integrated circuit technology; merging; mixed analogue-digital integrated circuits; GUI; IC circuitry analysis; TCL script extension support; analog/mix-signal IC; automatic backup/restore; digital devices; image acquisition; image merge technique; industrial products analysis; multiple language; multiple users accessible; project teamwork feasible; software environment; Circuit analysis; Delay; Image analysis; Image recognition; Optical distortion; Optical microscopy; Radiofrequency integrated circuits; Reverse engineering; Scanning electron microscopy; Software design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN :
0-7803-9301-5
Type :
conf
DOI :
10.1109/IPFA.2005.1469182
Filename :
1469182
Link To Document :
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