Failure analysis of lead-free Sn-Ag-Cu solder joints for 316 I/O PBGA package

Author

Xu, Luhua ; Pang, John H L ; Faxing, Che

Author_Institution

Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore

fYear

2005

fDate

27 June-1 July 2005

Firstpage

323

Lastpage

327

Abstract

Failure analysis of lead-free solder joints for PBGA assemblies subjected to thermal cycling aging is reported. Experimental strain analysis using the digital image speckle analysis (DISA) method is capable of measuring the strain concentration at the corner of the solder joint where thermal fatigue cracks initiate and propagate. A micro-digital image speckle correlation system (Micro-DISC) was employed for micro-deformation and strain analysis. The Sn-3.8Ag-0.7Cu soldered assembly was subject to a temperature ramp from room temperature of 25 °C to 125 °C. The failure site agrees with the high strain locations measured by DISA.

Keywords

assembling; ball grid arrays; copper alloys; deformation; failure analysis; fatigue cracks; plastic packaging; silver alloys; solders; speckle; tin alloys; DISA method; Micro-DISC; PBGA assembly; PBGA package; SnAgCu; digital image speckle analysis; failure analysis; lead-free solder joints; micro-deformation; micro-digital image speckle correlation system; plastic ball grid array; strain analysis; thermal cycling; thermal fatigue cracks; Assembly; Environmentally friendly manufacturing techniques; Failure analysis; Image analysis; Lead; Packaging; Soldering; Speckle; Strain measurement; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the

Print_ISBN

0-7803-9301-5

Type

conf

DOI

10.1109/IPFA.2005.1469188

Filename

1469188