A fully integrated multi-band MIMO WLAN transceiver RFIC

Author

Rogers, John W M ; Rahn, Dave G. ; Cavin, Mark S. ; Dai, Foster F. ; Fong, Neric ; Griffith, Richard ; Macedo, Jose ; Moore, David ; Toner, Mike

Author_Institution

Carleton Univ., Ottawa, Ont., Canada

fYear

2005

fDate

16-18 June 2005

Firstpage

290

Lastpage

293

Abstract

A multiple input multiple output transceiver compliant with IEEE 802.11a/b/g and Japan wireless LAN standards is presented. The transceiver has two complete radio paths integrated on the same chip. When two chips are used in tandem to form a four path composite beam forming system, 15dB of link margin improvement is obtained. The transceiver was implemented in a 47GHz SiGe technology and consumes 195mA in RX mode and 240mA in TX mode from a 2.75V supply.

Keywords

Ge-Si alloys; IEEE standards; MIMO systems; integrated circuit design; radiofrequency integrated circuits; transceivers; wireless LAN; 195 mA; 2.75 V; 240 mA; 47 GHz; IEEE 802.11a/b/g standard; MIMO WLAN transceiver; SiGe; composite beam forming system; integrated multiband transceiver; radiofrequency integrated circuit; wireless LAN standards; MIMO; Power system reliability; Radio transmitters; Radiofrequency integrated circuits; Receivers; Space technology; Streaming media; Telecommunication network reliability; Transceivers; Wireless LAN;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Circuits, 2005. Digest of Technical Papers. 2005 Symposium on

Print_ISBN

4-900784-01-X

Type

conf

DOI

10.1109/VLSIC.2005.1469388

Filename

1469388