Circuit and module challenges for 60 GHz Gb/s radio

Author

Laskar, J. ; Pinel, S. ; Lee, C.-H. ; Sarkar, S. ; Perumana, B. ; Papapolymerou, J. ; Tentzeris, E.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2005

fDate

3-7 April 2005

Firstpage

447

Lastpage

450

Abstract

The recent advances of CMOS and SiGe process technologies have now made the design of low-cost highly integrated millimeter-wave radios possible in silicon. In combination with an optimum packaging approach, this represents a unique opportunity to develop Gb/s radio that could address the increasing demand in term of data rate throughput of the emerging broadband wireless communication systems. In this paper, we discuss the circuit and module challenges that enables a successful deployment of 60 GHz gigabits wireless systems.

Keywords

CMOS integrated circuits; Ge-Si alloys; MIMIC; broadband networks; radio networks; semiconductor materials; 60 GHz; CMOS; SiGe; broadband wireless communication systems; data rate throughput; integrated millimeter-wave radios; optimum packaging approach; CMOS process; CMOS technology; Germanium silicon alloys; Integrated circuit technology; Millimeter wave communication; Millimeter wave integrated circuits; Millimeter wave technology; Packaging; Silicon germanium; Throughput;

fLanguage

English

Publisher

ieee

Conference_Titel

Wireless Communications and Applied Computational Electromagnetics, 2005. IEEE/ACES International Conference on

Print_ISBN

0-7803-9068-7

Type

conf

DOI

10.1109/WCACEM.2005.1469621

Filename

1469621