Title :
Failure mechanisms in semiconductor laser packaging
Author :
Chen, J.C. ; Chen, W.T. ; Chang, S.T. ; Horng, J.S. ; Lin, H.H. ; Sun, Mei J. ; Wang, W.H. ; Cheng, W.H.
Author_Institution :
Electron. & Syst. Lab., ITRI, Hsinchu, Taiwan
Abstract :
Summary form only given. Characteristics of failure mechanisms in laser welding technique for semiconductor laser packaging were investigated by metallographic microscopes. The results showed that both hole and crack failures in laser packaging can be eliminated. Based on the detailed understanding of failure mechanisms in laser welding process, a reduction of post-weld-shift (PWS) technique for fabricating laser packaging was presented.
Keywords :
failure analysis; laser beam welding; semiconductor device packaging; semiconductor lasers; cracks; fabrication; failure; holes; laser welding; metallographic microscopy; post-weld-shift technique; semiconductor laser packaging; Failure analysis; Inspection; Laser theory; Nonlinear optics; Optical surface waves; Plasma temperature; Semiconductor device packaging; Semiconductor lasers; Ultrasonic imaging; Welding;
Conference_Titel :
Lasers and Electro-Optics, 1996. CLEO '96., Summaries of papers presented at the Conference on
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
1-55752-443-2
