DocumentCode
3552507
Title
Large scale integrated biopolar arrays
Author
Tansil, Thomas B. ; Bohan, John L.
Author_Institution
Texas Instruments, Inc., Dallas, Texas.
Volume
12
fYear
1966
fDate
1966
Firstpage
66
Lastpage
66
Abstract
This paper discusses some of the major factors that should be taken into consideration in the design and fabrication of a large-scale digital integrated circuit array. It is assumed that the type of arrays to be considered are those which have three levels of metalized leads on a slice of silicon. The first level interconnects components to form circuits such as NAND gates. The second and third levels interconnect the gates to generate complex logic functions. The "discretionary" technique is used to interconnect the gates.
Keywords
Dielectric substrates; Digital integrated circuits; Fabrication; Flip-flops; Integrated circuit interconnections; Large scale integration; Logic functions; Packaging; Silicon; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1966 International
Type
conf
DOI
10.1109/IEDM.1966.187692
Filename
1474531
Link To Document