• DocumentCode
    3552507
  • Title

    Large scale integrated biopolar arrays

  • Author

    Tansil, Thomas B. ; Bohan, John L.

  • Author_Institution
    Texas Instruments, Inc., Dallas, Texas.
  • Volume
    12
  • fYear
    1966
  • fDate
    1966
  • Firstpage
    66
  • Lastpage
    66
  • Abstract
    This paper discusses some of the major factors that should be taken into consideration in the design and fabrication of a large-scale digital integrated circuit array. It is assumed that the type of arrays to be considered are those which have three levels of metalized leads on a slice of silicon. The first level interconnects components to form circuits such as NAND gates. The second and third levels interconnect the gates to generate complex logic functions. The "discretionary" technique is used to interconnect the gates.
  • Keywords
    Dielectric substrates; Digital integrated circuits; Fabrication; Flip-flops; Integrated circuit interconnections; Large scale integration; Logic functions; Packaging; Silicon; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1966 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1966.187692
  • Filename
    1474531