Title :
Large scale integrated biopolar arrays
Author :
Tansil, Thomas B. ; Bohan, John L.
Author_Institution :
Texas Instruments, Inc., Dallas, Texas.
Abstract :
This paper discusses some of the major factors that should be taken into consideration in the design and fabrication of a large-scale digital integrated circuit array. It is assumed that the type of arrays to be considered are those which have three levels of metalized leads on a slice of silicon. The first level interconnects components to form circuits such as NAND gates. The second and third levels interconnect the gates to generate complex logic functions. The "discretionary" technique is used to interconnect the gates.
Keywords :
Dielectric substrates; Digital integrated circuits; Fabrication; Flip-flops; Integrated circuit interconnections; Large scale integration; Logic functions; Packaging; Silicon; Wiring;
Conference_Titel :
Electron Devices Meeting, 1966 International
DOI :
10.1109/IEDM.1966.187692