Abstract :
The electrical characteristics of packaging and interconnections in high speed digital computers can introduce limiting restrictions on computer operation. Therefore, it is necessary for the designer to seriously consider the electrical characteristics of the physical design. The major considerations for high speed computer designs are propagation delay, clock pulse skew, noise, crosstalk, and integrated circuit performance. All of these considerations can be significantly enhanced by the implementation of the Teledyne Micro Electronic Modular Assembly (MEMA) packaging technique. The MEMA is a hybrid electronic module. It consists of a flat pack containing up to 30 integrated circuit "bare chips" interconnected on an alumina substrate and hermatically sealed. This large functional complexity contained in a volume of less than 1/20 cubic inch permits a high speed computer to be implemented with a minimum of problems associated with the considerations described.
