Compliant bonding - A new technique for joining microelectronic components

Rapidly expanding emphasis on microelectronic circuitry has produced increasing demands in solid state bonding techniques. For example, an important manufacturing step in the use of beam-leaded integrated circuits is joining the leads to surrounding circuitry. Economically, it is desirable to bond all leads simultaneously, however, when doing this a number of potential difficulties related to uniform deformation of all leads must be dealt with. One solution to these problems is a solid state joining process called compliant bonding.