DocumentCode
3552944
Title
Technology and physical properties of FeSi2 -thermocouples
Author
Hesse, J. ; Birkholz, U.
Author_Institution
AEG-Telefunken, Forschungsinstitut, Frankfurt, Germany
Volume
14
fYear
1968
fDate
1968
Firstpage
128
Lastpage
128
Abstract
The application of doped FeSi2 for thermoelectric generation was first discussed by R. M. Ware and D. J. McNeill. We have extended thier investigations by studying the influence of sample preparation and doping more closely. By a systematic variation of the parameters for powder metallurgic preparation and by application of hydro-static pressure these properties could be improved considerably. They were in no way inferior to those found for samples prepared by normal freezing methods. Further, the influence of various dopants on the thermo-electric properties was determined. It was found that Al, Ga, Mn and Cr act as acceptors and P, Co and Ni as donors. For these dopants we have measured the temperature dependence of Seebeck coefficient, electrical conductivity and Hall coefficient in detail. The most important result is the strong increse of the thermoelectric figure of merit with temperature for n-FeSi2 to 10-3grad-1at 1000°K. This behaviour can be explained by the assumption that the electrical conduction is caused by small polarons, as discussed by U. Birkholz and J. Schelm. On the other hand, for p-FeSi2 , only a weak temperature dependence was observed, as expected for conduction according to a band model. Maximum figure of merit values were obtained with Al or Cr for p-type and Co for n-type material. Thermocouples made of these materials can operate up to 1000°K. For example, with a hot junction temperature of 1000°K and a cold junction temperature of 400°K and using cube shaped legs (0.6 cm) a power output of about 0.7 W was obtained.
Keywords
Chromium; Conducting materials; Conductivity measurement; Doping; Electric variables measurement; Leg; Powders; Temperature dependence; Temperature measurement; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1968 International
Type
conf
DOI
10.1109/IEDM.1968.188054
Filename
1475579
Link To Document