DocumentCode
3553104
Title
A planar multi-layer interconnection
Author
Shiba, H.
Volume
15
fYear
1969
fDate
1969
Firstpage
128
Lastpage
130
Abstract
A new structure and fabrication method of multi-layer interconnections have been developed. The feature of this method lies in the use of an anodic oxidation technique instead of the conventional metal etching in the formation of interconnection patterns.
Keywords
Aluminum oxide; Application specific integrated circuits; Chemicals; Etching; Integrated circuit interconnections; Large scale integration; Metallization; Oxidation; Semiconductor films; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1969 International
Type
conf
DOI
10.1109/IEDM.1969.188181
Filename
1476062
Link To Document