DocumentCode
3553947
Title
Chemical vapor deposition of tin oxide films
Author
Baliga, Jayant B. ; Ghandhi, Sorab K.
Author_Institution
General Electric Company, Schenectady, New York
Volume
21
fYear
1975
fDate
1975
Firstpage
105
Lastpage
107
Abstract
A new technique is described for the deposition of SnO2 films based upon the pyrolysis of tetramethyltin (TMT) in oxygen at relatively low temperatures (
c). As a source, TMT has the advantages of being stable in air and moisture, and of being a liquid with a relatively high vapor pressure at room temperature. Thus, a simple bubbler system is used to transport its vapors to the reaction chamber. The deposition technique is characterized by (1) high and controllable growth rates (more than 300 Å/min), (2) high conductivity layers (more than 30 Ω cm-1undoped), and (3) highly transparent layers in the visible range more than 95% transmission for 1500 Å layers). In addition, the films can be doped to achieve conductivities as high as 200 cm-1without loss in transmission. Finally, fast, effective low temperature anneals with forming gas in an open tube system can be used to result in a two-fold increase in conductivity.
c). As a source, TMT has the advantages of being stable in air and moisture, and of being a liquid with a relatively high vapor pressure at room temperature. Thus, a simple bubbler system is used to transport its vapors to the reaction chamber. The deposition technique is characterized by (1) high and controllable growth rates (more than 300 Å/min), (2) high conductivity layers (more than 30 Ω cm-1undoped), and (3) highly transparent layers in the visible range more than 95% transmission for 1500 Å layers). In addition, the films can be doped to achieve conductivities as high as 200 cm-1without loss in transmission. Finally, fast, effective low temperature anneals with forming gas in an open tube system can be used to result in a two-fold increase in conductivity.Keywords
Chemical vapor deposition; Conductive films; Conductivity; Glass; Inductors; Moisture; Semiconductor films; Substrates; Temperature distribution; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1975 International
Type
conf
DOI
10.1109/IEDM.1975.188836
Filename
1478197
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