• DocumentCode
    3553947
  • Title

    Chemical vapor deposition of tin oxide films

  • Author

    Baliga, Jayant B. ; Ghandhi, Sorab K.

  • Author_Institution
    General Electric Company, Schenectady, New York
  • Volume
    21
  • fYear
    1975
  • fDate
    1975
  • Firstpage
    105
  • Lastpage
    107
  • Abstract
    A new technique is described for the deposition of SnO2films based upon the pyrolysis of tetramethyltin (TMT) in oxygen at relatively low temperatures ( \\simeq 450\\deg c). As a source, TMT has the advantages of being stable in air and moisture, and of being a liquid with a relatively high vapor pressure at room temperature. Thus, a simple bubbler system is used to transport its vapors to the reaction chamber. The deposition technique is characterized by (1) high and controllable growth rates (more than 300 Å/min), (2) high conductivity layers (more than 30 Ω cm-1undoped), and (3) highly transparent layers in the visible range more than 95% transmission for 1500 Å layers). In addition, the films can be doped to achieve conductivities as high as 200 cm-1without loss in transmission. Finally, fast, effective low temperature anneals with forming gas in an open tube system can be used to result in a two-fold increase in conductivity.
  • Keywords
    Chemical vapor deposition; Conductive films; Conductivity; Glass; Inductors; Moisture; Semiconductor films; Substrates; Temperature distribution; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1975 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1975.188836
  • Filename
    1478197