DocumentCode
3553999
Title
A new n-channel Si-gate technology for high packing density, high-speed MOS LSI
Author
Kubota, N. ; Shibata, T. ; Ohuchi, K. ; Hirabayashi, K. ; Horiuchi, S.
Author_Institution
Tokyo Shibaura Electric Co., Ltd., Kawasaki, JAPAN
Volume
21
fYear
1975
fDate
1975
Firstpage
295
Lastpage
298
Abstract
A newly developed n-channel Si-gate technology, "Gate Oxidation Method" (G.O.M.), uses high resistivity substrates (20Ω.cm) and only one boron ion implantation process. The E-mode transistor threshold voltage is controlled by the lost boron ions into the growing gate oxide.
Keywords
Boron; Circuit testing; Conductivity; Ion implantation; Large scale integration; Oxidation; Silicon; Substrates; Temperature; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1975 International
Type
conf
DOI
10.1109/IEDM.1975.188883
Filename
1478244
Link To Document