DocumentCode
3554292
Title
Diamond as a support material for TWT helices
Author
Harper, Robert ; Pittack, Uwe
Author_Institution
Raytheon Company, Waltham, Massachusetts
Volume
22
fYear
1976
fDate
1976
Firstpage
655
Lastpage
658
Abstract
This paper presents a status report on the development of methods for using diamond supports for helix slow-wave structures in TWT´s. The motivation for using diamonds in this fashion is the need for higher average output power octave bandwidth coverage in the higher frequency regions. The limit of average output power for octave bandwidth helix TWT´s is determined by the thermal conduction from the helix to the outer shell, and has always been directly related to the helix support material. Progress was made by replacing glass with alumina, and alumina with beryllia and boron nitride. Natural diamond is an excellent dielectric and has a thermal conductivity over three times better than copper and ten times better than beryllia. The use of diamond dielectric helix supports, therefore, provides the next logical step to increase the output power of helix TWT´s. In recent years, the necessary technology has been developed to metalize and braze diamonds for use in diamond-supported helix structures.
Keywords
Assembly; Bandwidth; Boron; Conducting materials; Copper; Dielectrics; Frequency; Heat sinks; Power generation; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1976 International
Type
conf
DOI
10.1109/IEDM.1976.189131
Filename
1478843
Link To Document