High packing linear integrated circuits using planar metallization with polymer

A linear IC for the TV chroma systems has been packed on a 2.34×2.36mm²chip using a two-level interconnection with Planar Metallization with Polymer (PMP) technology, and is packaged by plastic direct molding. The chip area of this device is reduced about 40% as compared to the conventional device with the sam function. Advanced PMF technique makes it possible to realize this linear IC with high yields and high reliability. In this technique; (1) Purified PIQ (a high heat resisting polyimide, Na 0.5ppm) is used for insulating layers. (2) A special solution of hydrazine-hydrate has been developed to etch the PIQ layer to form via-holes down to 3×3µm. Yield of via-hole contact proved to be over 99.9998%. (3) PMP makes it possible to place the pads for thermo-compression bonding on the active region of the device. (4) Pinhole density of the PIQ layer is less than 0.05/cm². Failure of interconnection has not been observed in the reliability test.