DocumentCode
3554705
Title
High performance junction photodiodes for 8-14 µm (Hg,Cd)Te infrared imaging applications
Author
Sood, A.K. ; Tredwell, T.J.
Author_Institution
Honeywell Electro-Optics Center, Lexington, Massachusetts
fYear
1978
fDate
4-6 Dec. 1978
Firstpage
434
Lastpage
436
Abstract
Fabrication of n+-p junction photodiodes by boron implantation have been carried out in 8-12 µm p-Hg0.8 Cd0.2 Te. These photodiodes exhibit quantum efficiencies and D*λ(1 kHz, 180° FOV, 300 K) in excess of 0.6 and 2.0 × 1010cm√Hz/W. Measurements of the resistance area product (Ro Aj ) as a junction of temperature between 77 and 200 K demonstrate that the current in these photodiodes is diffusion limited down to 77 K.
Keywords
Annealing; Area measurement; Boron; Contracts; Current measurement; Fabrication; Implants; Infrared imaging; Photodiodes; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1978 International
Conference_Location
Washigton, DC, USA
Type
conf
DOI
10.1109/IEDM.1978.189447
Filename
1479872
Link To Document