• DocumentCode
    3555131
  • Title

    An ion-implanted N-well bipolar process for university analog integrated circuit fabrication

  • Author

    Pietra, Andrew R La ; Fuller, Lynn

  • Author_Institution
    Rochester Inst. of Technol., NY, USA
  • fYear
    1991
  • fDate
    12-14 Jun 1991
  • Firstpage
    54
  • Lastpage
    59
  • Abstract
    A five-mask-level, isolated bipolar process was developed. Phosphorous was selectively implanted and annealed into p-type wafers to form the electrically isolated n-wells, and a double diffusion process was used to create active devices inside the n-wells. Several bipolar transistors and simple circuits were successfully fabricated and tested over three developmental processing runs
  • Keywords
    bipolar integrated circuits; elemental semiconductors; integrated circuit technology; ion implantation; linear integrated circuits; phosphorus; silicon; Si:P; active devices; developmental processing runs; double diffusion process; electrically isolated n-wells; ion-implanted N-well bipolar process; isolated bipolar process; p-type wafers; university analog integrated circuit fabrication; Analog integrated circuits; Ash; Circuit testing; Diffusion processes; Fabrication; Isolation technology; Microelectronics; Plasma applications; Plasma devices; Resists;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    University/Government/Industry Microelectronics Symposium, 1991. Proceedings., Ninth Biennial
  • Conference_Location
    Melbourne, FL
  • ISSN
    0749-6877
  • Print_ISBN
    0-7803-0109-9
  • Type

    conf

  • DOI
    10.1109/UGIM.1991.148121
  • Filename
    148121