DocumentCode
3555339
Title
Recessed gate junction field effect transistors
Author
Baliga, B.Jayant
Author_Institution
General Electric Company, Schenectady, NY
Volume
26
fYear
1980
fDate
1980
Firstpage
784
Lastpage
786
Abstract
A recessed gate structure is described for vertical channel junction gate field effect transistors. This structure can be fabricated using a self-aligned source-gate process with the use of only two masking steps for the fabrication of the device active region. Devices fabricated with this structure exhibit blocking voltages of upto 400 volts with blocking gains ranging from 3 to 12 depending upon the groove depth. These devices have a unity power gain cut-off frequency above 500 MHz.
Keywords
Bipolar transistors; Electric breakdown; FETs; Fabrication; JFETs; MOSFETs; Oxidation; Silicon compounds; Surface resistance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1980 International
Type
conf
DOI
10.1109/IEDM.1980.189955
Filename
1481398
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