DocumentCode :
3555339
Title :
Recessed gate junction field effect transistors
Author :
Baliga, B.Jayant
Author_Institution :
General Electric Company, Schenectady, NY
Volume :
26
fYear :
1980
fDate :
1980
Firstpage :
784
Lastpage :
786
Abstract :
A recessed gate structure is described for vertical channel junction gate field effect transistors. This structure can be fabricated using a self-aligned source-gate process with the use of only two masking steps for the fabrication of the device active region. Devices fabricated with this structure exhibit blocking voltages of upto 400 volts with blocking gains ranging from 3 to 12 depending upon the groove depth. These devices have a unity power gain cut-off frequency above 500 MHz.
Keywords :
Bipolar transistors; Electric breakdown; FETs; Fabrication; JFETs; MOSFETs; Oxidation; Silicon compounds; Surface resistance; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1980 International
Type :
conf
DOI :
10.1109/IEDM.1980.189955
Filename :
1481398
Link To Document :
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