• DocumentCode
    3555339
  • Title

    Recessed gate junction field effect transistors

  • Author

    Baliga, B.Jayant

  • Author_Institution
    General Electric Company, Schenectady, NY
  • Volume
    26
  • fYear
    1980
  • fDate
    1980
  • Firstpage
    784
  • Lastpage
    786
  • Abstract
    A recessed gate structure is described for vertical channel junction gate field effect transistors. This structure can be fabricated using a self-aligned source-gate process with the use of only two masking steps for the fabrication of the device active region. Devices fabricated with this structure exhibit blocking voltages of upto 400 volts with blocking gains ranging from 3 to 12 depending upon the groove depth. These devices have a unity power gain cut-off frequency above 500 MHz.
  • Keywords
    Bipolar transistors; Electric breakdown; FETs; Fabrication; JFETs; MOSFETs; Oxidation; Silicon compounds; Surface resistance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1980 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1980.189955
  • Filename
    1481398