DocumentCode :
3555441
Title :
A new failure mechanism in Schottky barrier diodes with Al-Cu-Si metallurgy
Author :
Kim, Sang U.
Author_Institution :
IBM General Technology Division, Essex Junction, Vermont
Volume :
27
fYear :
1981
fDate :
1981
Firstpage :
74
Lastpage :
77
Abstract :
A new defect responsible for the anomalous leakage current in Al-Cu-Si metallized Schottky Barrier Diode (SBD) has been found. The defect is designated the "CuAl2/Si defect." The nature of the defect, its formation and leakage inducing attributes are analyzed and established. Process parameter controls to prevent the CuAl2/Si defect formation are described.
Keywords :
Copper; Failure analysis; Leakage current; Low voltage; Metallization; Schottky barriers; Schottky diodes; Silicon; Temperature; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1981 International
Type :
conf
DOI :
10.1109/IEDM.1981.190002
Filename :
1481955
Link To Document :
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