Title :
A new failure mechanism in Schottky barrier diodes with Al-Cu-Si metallurgy
Author_Institution :
IBM General Technology Division, Essex Junction, Vermont
Abstract :
A new defect responsible for the anomalous leakage current in Al-Cu-Si metallized Schottky Barrier Diode (SBD) has been found. The defect is designated the "CuAl2/Si defect." The nature of the defect, its formation and leakage inducing attributes are analyzed and established. Process parameter controls to prevent the CuAl2/Si defect formation are described.
Keywords :
Copper; Failure analysis; Leakage current; Low voltage; Metallization; Schottky barriers; Schottky diodes; Silicon; Temperature; Tunneling;
Conference_Titel :
Electron Devices Meeting, 1981 International
DOI :
10.1109/IEDM.1981.190002