Title :
Integrated power devices
Author_Institution :
Siemens AG, Munich, Germany
Abstract :
One of the two main trends in the power integration is the combination of logic functions with high voltage output stages resulting in complex HVIC chips which are mainly used for display driving and telecommunication applications. The other trend is to build high current high voltage structures with integrated additional functions making the power devices better compatible to normal IC´s and microcomputers.
Keywords :
Electric breakdown; Insulation; Ion implantation; Logic devices; Low voltage; MOS devices; P-n junctions; Space charge; Switches; Thyristors;
Conference_Titel :
Electron Devices Meeting, 1982 International
DOI :
10.1109/IEDM.1982.190196
