DocumentCode
3555862
Title
A reduced size CMOS SRAM cell structure with two-level Al interconnection
Author
Kudoh, O. ; Sakai, I. ; Murakami, S. ; Yamamoto, H.
Author_Institution
Nippon Electric Co., Ltd., Kanagawa, Japan
Volume
28
fYear
1982
fDate
1982
Firstpage
474
Lastpage
477
Abstract
A reduced size full CMOS SRAM cell structure having three Al wiring pitches, instead of conventional five Al wiring pitches, has been demonstrated experimentally by using an advanced two-level Al interconnect technology. A cell size measuring
(=269
m2), which is at least less than 70% of the conventional five pitch cell\´s size, has been realized. In order to investigate various technical issues relating to the CMOS SRAM with this new cell structure, a 1 Kb CMOS SRAM was fabricated, and its device operation characteristics were examined. Access time of less than 25 ns, and standby current of less than 1 nA, have been achieved with the SRAM. With this cell structure, cell area of 64 Kb CMOS SRAM has been estimated to be 17.7 mm2. Considerable speed improvement is also expected using this cell structure.
(=269
m2), which is at least less than 70% of the conventional five pitch cell\´s size, has been realized. In order to investigate various technical issues relating to the CMOS SRAM with this new cell structure, a 1 Kb CMOS SRAM was fabricated, and its device operation characteristics were examined. Access time of less than 25 ns, and standby current of less than 1 nA, have been achieved with the SRAM. With this cell structure, cell area of 64 Kb CMOS SRAM has been estimated to be 17.7 mm2. Considerable speed improvement is also expected using this cell structure.Keywords
CMOS process; CMOS technology; Impedance; Large scale integration; Power dissipation; Random access memory; Size measurement; Very large scale integration; Voltage; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1982 International
Type
conf
DOI
10.1109/IEDM.1982.190328
Filename
1482862
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