DocumentCode :
3555887
Title :
Mo2N/Mo gate MOSFETs
Author :
Kim, Manjin J. ; Brown, Dale M.
Author_Institution :
General Electric Company, Schenectady, NY
Volume :
28
fYear :
1982
fDate :
1982
Firstpage :
560
Lastpage :
563
Abstract :
Molybdenum nitride coatings on molybdenum using a direct reaction of molybdenum with ammonia is used to improve the gate electrode properties of Mo gate self-aligned MOSFETs. The Mo2N double layer gate shows resistance against oxidation, processing reagents and improved ion implantation masking. The work function of the double layer film was determined to be 4.69 ± 0.03 eV which is independent of the nitride thickness and annealing conditions. Boron implantation range is smaller in Mo2N than Mo. A Mo2N coating of 870Å over 2130Å Mo masks up to 60 keV B11 and 120 keV As75. The implantation study covers the energy range from 15 to 70 keV for boron and from 40 to 160 keV for arsenic.
Keywords :
Annealing; Boron; Chemical processes; Coatings; Conductivity; Etching; Fabrication; MOS devices; Pollution measurement; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1982 International
Type :
conf
DOI :
10.1109/IEDM.1982.190353
Filename :
1482887
Link To Document :
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