DocumentCode
3555896
Title
Submicron GaAs vertical electron transistor
Author
Mishra, U. ; Kohn, E. ; Eastman, L.F.
Author_Institution
Cornell University, Ithaca, NY
Volume
28
fYear
1982
fDate
1982
Firstpage
594
Lastpage
597
Abstract
To achieve high frequency performance in a transistor, along with low parasitics, the intrinsic device should have very low transit time of carriers from source to the drain. We report on the fabrication and D.C. characterization of vertical transistors with 0.5
m drain to source spacing and with sub-
m channel widths. A gm of 81 mS/mm was achieved in the devices doped at
cm-3and 47 mS/mm in those doped at
cm-3. We propose this structure as a convenient method of studying the influence of near-ballistic electron motion on transistor performance.
m drain to source spacing and with sub-
m channel widths. A g
cm-3and 47 mS/mm in those doped at
cm-3. We propose this structure as a convenient method of studying the influence of near-ballistic electron motion on transistor performance.Keywords
Electrons; Etching; Fabrication; Fingers; Frequency; Gallium arsenide; Gold; Metallization; Neodymium; Ohmic contacts;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1982 International
Type
conf
DOI
10.1109/IEDM.1982.190362
Filename
1482896
Link To Document