DocumentCode
3556030
Title
HISETS: A software system for designing semiconductor device packages
Author
Yasukawa, Akio ; Sakamoto, Tatsuji ; Shida, Shigeru
Author_Institution
Hitachi Ltd., Tsuchiura, Japan
Volume
29
fYear
1983
fDate
1983
Firstpage
259
Lastpage
262
Abstract
HISETS (Hitachi Semiconductor Thermal Strength Design System), a software system for designing semiconductor device packages was developed. Five programs are linked together to form a unified analysis of six important package design characteristics; (1) Thermal resistance, (2) Thermal deformation, (3) Thermal stress, (4) Heat resistance of chips and substrates, (5) Life of bonding layer, and (6) Change in electrical characteristics due to stress. An appropriate structure can be quickly obtained by simulating the revision of a structure until calculated results satisfy desired specifications.
Keywords
Electric resistance; Resistance heating; Semiconductor device packaging; Semiconductor devices; Software design; Software packages; Software systems; Substrates; Thermal resistance; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1983 International
Type
conf
DOI
10.1109/IEDM.1983.190490
Filename
1483615
Link To Document