DocumentCode
3556100
Title
A fully-self-aligned joint-gate CMOS technology
Author
Robinson, A.L. ; Antoniadis, D.A. ; Maby, E.W.
Author_Institution
Massachusetts Institute of Technology, Cambridge, MA
Volume
29
fYear
1983
fDate
1983
Firstpage
530
Lastpage
533
Abstract
A six-mask process that provides joint-gate CMOS structures with the source and drain of both transistors self-aligned to the joint-gate electrode has been developed. The features that permit the full self-alignment are an edge-defined silicon nitride "filament" (used as an oxidation mask) and overlapping polysilicon "handles" used to form the top transistor source and drain regions. The structures have been characterized as individual nMOS and pMOS transistors and are functional as joint-gate CMOS inverters.
Keywords
CMOS technology; Doping; Electrodes; Etching; Implants; Oxidation; Plasma applications; Protection; Silicon; Sulfur hexafluoride;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1983 International
Type
conf
DOI
10.1109/IEDM.1983.190560
Filename
1483685
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