• DocumentCode
    3556100
  • Title

    A fully-self-aligned joint-gate CMOS technology

  • Author

    Robinson, A.L. ; Antoniadis, D.A. ; Maby, E.W.

  • Author_Institution
    Massachusetts Institute of Technology, Cambridge, MA
  • Volume
    29
  • fYear
    1983
  • fDate
    1983
  • Firstpage
    530
  • Lastpage
    533
  • Abstract
    A six-mask process that provides joint-gate CMOS structures with the source and drain of both transistors self-aligned to the joint-gate electrode has been developed. The features that permit the full self-alignment are an edge-defined silicon nitride "filament" (used as an oxidation mask) and overlapping polysilicon "handles" used to form the top transistor source and drain regions. The structures have been characterized as individual nMOS and pMOS transistors and are functional as joint-gate CMOS inverters.
  • Keywords
    CMOS technology; Doping; Electrodes; Etching; Implants; Oxidation; Plasma applications; Protection; Silicon; Sulfur hexafluoride;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1983 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1983.190560
  • Filename
    1483685